Description
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Size die brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy manoeuvrability, the die brush easily rolls away excess paper to reveal the perfect cut! the die brush includes a foam pad that acts as the perfect work surface for removing excess paper from the dies and even the cut-out.
Sizzix Die Brush and Foam Pad 660513 for Wafer-Thin Dies, One Size, None
Price is below average
Current Price
$6.49
Average
$8.68
Min Price
$4.23
Max Price
$11.69
Price dynamics
25%
Description
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Size die brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy manoeuvrability, the die brush easily rolls away excess paper to reveal the perfect cut! the die brush includes a foam pad that acts as the perfect work surface for removing excess paper from the dies and even the cut-out.
Price will be lower
in next 2 weeks
in next 2 weeks
According to the data, price will be lower in next two weeks, so not waste your money and track better price!
