CUI Inc HSE-B20250-045H HSE Series 50 x 30 x 12 mm 4.05°C/W Black Anodized PC Pin TO-220 Heatsink - 25 item(s)

Thermal management is increasingly needed when dealing with electronics to satisfy the objectives of functional integrity and operational integrity. A lower temperature will yield satisfactory function and increase the expected life of the electronics. The application of a heat sink satisfies those two objectives. A heat sink is a heat dissipation device that consists of a base and fins that extend outward. The performance of a heat sink is affected by factors such as air velocity, choice of material, fin design and surface treatment. When a chip heats up from use, a heat sink removes and disperses the heat to keep the chip at a proper operational temperature. The mechanism of transport is by conduction, convection and radiation. The heat comes into the fins and then the flow takes it away by change of enthalpy across the surface. Without the use of a heat sink, the chip could overheat